Invention Grant
- Patent Title: Connectors using shape memory alloy
-
Application No.: US17108567Application Date: 2020-12-01
-
Publication No.: US12113310B2Publication Date: 2024-10-08
- Inventor: Brett R. Herdendorf , Riyan Alex Mendonsa , Wolfgang Rosner , Krishnan Subramanian
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Fremont
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Fremont
- Agency: Mueting Raasch Group
- Main IPC: H01R12/85
- IPC: H01R12/85 ; H01R4/01 ; H05K3/32

Abstract:
Connector devices or connectors for use in interconnection to a circuit board may be configured in an open or closed configuration. The connectors devices may utilize a shape memory alloy (SMA) actuator to move clamping portions with respect to each other into one or both of the open or closed positions.
Public/Granted literature
- US20220173539A1 CONNECTORS USING SHAPE MEMORY ALLOY Public/Granted day:2022-06-02
Information query
IPC分类: