Invention Grant
- Patent Title: Cable assembly, signal transmission structure, and electronic device
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Application No.: US17942442Application Date: 2022-09-12
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Publication No.: US12114425B2Publication Date: 2024-10-08
- Inventor: Guodong Zhang , Chong Chen , Jian Zhang , Shaoyong Xiang , Zhijun Qu , Changxing Sun
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Priority: CN 2010178016.7 2020.03.13
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/11 ; H05K1/18
Abstract:
A signal transmission structure includes a circuit board, a chip, and a cable assembly. The chip is assembled on one side of the circuit board, and the cable assembly is assembled on the other side of the circuit board. The cable assembly includes a cable, and the circuit board includes a plurality of conductive holes. The chip is electrically connected to the cable of the cable assembly using the conductive hole to transmit a signal of the chip using the cable.
Public/Granted literature
- US20230007773A1 Cable Assembly, Signal Transmission Structure, and Electronic Device Public/Granted day:2023-01-05
Information query
