A method of evaluating quality of a wafer or an apparatus of evaluating quality of a wafer may include: performing a copper-haze evaluation on a piece of wafer or a single crystal ingot; collecting copper-haze map data and a copper-haze evaluation score based on a result of the copper-haze evaluation; training an artificial intelligence model based on the copper-haze map data and the copper-haze evaluation score; and performing crystal defect evaluation on the piece of the wafer or the single crystal ingot using the learned artificial intelligence model that outputs the copper-haze evaluation score when the copper-haze map data is input.