Invention Grant
- Patent Title: Coil component
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Application No.: US17180086Application Date: 2021-02-19
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Publication No.: US12119165B2Publication Date: 2024-10-15
- Inventor: Ye Ji Jung , Jae Hun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200160819 2020.11.26
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/00 ; H01F27/32

Abstract:
A coil component includes: a body; a coil unit disposed in the body; a support substrate unit in contact with the coil unit to support the coil unit, and including first and second support substrates spaced apart from and oppose each other; and first and second external electrodes disposed on a first surface of the body and spaced apart from each other, and respectively connected to the coil unit.
Public/Granted literature
- US20220165486A1 COIL COMPONENT Public/Granted day:2022-05-26
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