Invention Grant
- Patent Title: Semiconductor bonding structures and methods
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Application No.: US16588588Application Date: 2019-09-30
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Publication No.: US12119238B2Publication Date: 2024-10-15
- Inventor: Meng-Tse Chen , Hsiu-Jen Lin , Wei-Hung Lin , Kuei-Wei Huang , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16046211 2018.07.26
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00 ; H01L25/00 ; H01L25/065 ; H01L25/10
Abstract:
A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.
Public/Granted literature
- US20200035510A1 Semiconductor Bonding Structures and Methods Public/Granted day:2020-01-30
Information query
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