Invention Grant
- Patent Title: Fusion memory device and method of fabricating the same
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Application No.: US17883682Application Date: 2022-08-09
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Publication No.: US12119336B2Publication Date: 2024-10-15
- Inventor: Hyunmog Park , Daehyun Kim , Jinmin Kim , Hei Seung Kim , Hyunsik Park , Sangkil Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20180167111 2018.12.21
- Main IPC: H01L25/18
- IPC: H01L25/18 ; G11C14/00 ; G11C16/04 ; H01L23/48 ; H01L23/522 ; H01L25/00 ; H10B41/00 ; H10B41/27 ; H10B43/27 ; G11C13/00 ; H10B41/41

Abstract:
Disclosed are fusion memory devices and methods of fabricating the same. The fusion memory device comprises a first memory device including a first substrate having active and inactive surfaces opposite to each other and a first memory cell circuit on the active surface of the first substrate, a non-memory device including a second substrate having active and inactive surfaces opposite to each other and a non-memory circuit on the active surface of the second substrate, the non-memory device being provided on the first memory device, and a second memory device on the inactive surface of the second substrate and including a second memory cell circuit different from the first memory cell circuit. The non-memory device lies between the first and second memory cell circuits and controls an electrical operation of each of the first and second memory cell circuits.
Public/Granted literature
- US20220384410A1 FUSION MEMORY DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-12-01
Information query
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