A female connector is connected to a PCB board internally provided with a signal layer and a ground layer. A surface of the PCB board includes conductive pads connected to the signal layer and the ground layer. The female connector includes a female terminal having first and second ends. The second end includes differential signal pairs arranged at intervals and ground pins each located between an adjacent two of the differential signal pairs. The differential signal pairs are connectable to the signal layer through the conductive pads. The ground pins are connectable to the ground layer through the conductive pads. A high-frequency radiation area is in the vicinity of a joint between the differential signal pair and the conductive pad when the first end is mated with a male connector or circuit board. A wave-absorbing material is disposed in a spatial range covered by the high-frequency radiation area.