Provided is a technique that can achieve an insulating layer with small surface undulations and can suppress a haloing phenomenon in manufacturing a printed wiring board even when using a thin resin composition layer. Specifically, provided is a method for manufacturing a printed wiring board that includes the steps of: (A) preparing a resin sheet with an inorganic layer including (i) a support with an inorganic layer including an inorganic layer, a support in contact with the inorganic layer, and a release layer and (ii) a resin composition layer in contact with the release layer of the support with an inorganic layer; (B) laminating the resin sheet with an inorganic layer onto an internal layer substrate so that the resin composition layer of the resin sheet with an inorganic layer is in contact with the internal layer substrate; (C) curing the resin composition layer to form an insulating layer; and (D) perforating the insulating layer.