Invention Grant
- Patent Title: Resin composition for solar cell encapsulant, solar cell encapsulant, manufacturing method of solar cell encapsulant, and solar cell module
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Application No.: US17783820Application Date: 2020-12-09
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Publication No.: US12125928B2Publication Date: 2024-10-22
- Inventor: Kei Nagayama , Kana Kukita , Motoaki Isokawa
- Applicant: DOW-MITSUI POLYCHEMICALS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOW-MITSUI POLYCHEMICALS CO., LTD.
- Current Assignee: DOW-MITSUI POLYCHEMICALS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: RANKIN, HILL & CLARK LLP
- Priority: JP 19226268 2019.12.16
- International Application: PCT/JP2020/045805 2020.12.09
- International Announcement: WO2021/125004A 2021.06.24
- Date entered country: 2022-06-09
- Main IPC: H01L31/048
- IPC: H01L31/048 ; B32B27/08 ; C08F210/02 ; C08F210/16 ; C08F218/08 ; C08F220/32 ; C08F230/08 ; C08J5/18 ; C08K5/24 ; C08K5/3472
Abstract:
A resin composition for a solar cell encapsulant that is used for forming a solar cell encapsulant, the resin composition including at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene-α-olefin copolymer (B), and a metal inactivating agent (C).
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Information query
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