- 专利标题: Wiring circuit board
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申请号: US17802421申请日: 2020-12-18
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公开(公告)号: US12127336B2公开(公告)日: 2024-10-22
- 发明人: Takahito Azuma , Yoshito Fujimura
- 申请人: NITTO DENKO CORPORATION
- 申请人地址: JP Osaka
- 专利权人: NITTO DENKO CORPORATION
- 当前专利权人: NITTO DENKO CORPORATION
- 当前专利权人地址: JP Osaka
- 代理机构: Edwards Neils LLC
- 代理商 Jean C. Edwards, Esq.
- 优先权: JP 20035856 2020.03.03
- 国际申请: PCT/JP2020/047477 2020.12.18
- 国际公布: WO2021/176803A 2021.09.10
- 进入国家日期: 2022-08-25
- 主分类号: H05K1/02
- IPC分类号: H05K1/02
摘要:
A suspension board with circuit extending in a predetermined direction includes a base insulating layer, and a conductive layer disposed on one side in a thickness direction of the base insulating layer. The base insulating layer includes a first body base and a second body base disposed spaced apart from each other in a width direction, and a connection portion connecting a portion of the first body base in the longitudinal direction to a portion of the second body base in the longitudinal direction. The suspension board with circuit further includes a reinforcing portion disposed on the surface of the connection portion and reinforcing the connection portion. The reinforcing portion includes two or more resin layers laminated in the thickness direction, or a metal member.
公开/授权文献
- US20230094708A1 WIRING CIRCUIT BOARD 公开/授权日:2023-03-30
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