There is a need for better cooling solutions for the ever-increasing thermal density of computing systems. This is solved by providing a radiator (100) for a liquid cooling system for cooling a computing unit, the radiator comprising:—a first manifold (101) and a second manifold (102) having among them two liquid openings (103, 104) for connecting the radiator in a liquid loop, —channels (110) extending between the first manifold (101) and the second manifold (102) and providing parallel liquid paths between the manifolds (101, 102), —fin layers (130) sandwiched between sets of neighbouring channels (110) and extending between the first manifold (101) and the second manifold (102), —fastening means (120) for attaching a fan (10) to the radiator (100) in a predetermined position, determining a ring-shaped high-pressure zone (142) corresponding to an outer area of a fan radius (122) of an attached fan, where—at least one fin layer has a low-density section placed away from the high-pressure zone, and a high-density section being located in the high-pressure zone and having a higher fin density than the low-density section, —the density of the group of fin layers thereby varies both along the channels but also transverse of each channel, resulting in two-dimensional density variations across the radiator surface, sections of fins to be positioned in front of the ring-shaped high-pressure zone has a higher density than the section of fins away from the ring-shaped high-pressure zone.