Invention Grant
- Patent Title: Array substrate, fabrication method therefor and display device
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Application No.: US17764512Application Date: 2021-05-14
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Publication No.: US12133445B2Publication Date: 2024-10-29
- Inventor: Meng Zhao
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Arch & Lake LLP
- Priority: CN 2010529286.8 2020.06.11
- International Application: PCT/CN2021/093900 2021.05.14
- International Announcement: WO2021/249117A 2021.12.16
- Date entered country: 2022-03-28
- Main IPC: H01L27/32
- IPC: H01L27/32 ; G06V40/13 ; H10K59/122 ; H10K59/65 ; H10K71/00 ; H10K71/20 ; H10K59/12

Abstract:
A method for fabricating an array substrate, comprising: providing a base substrate; forming a driving-circuit layer, which comprises first driving circuits and second driving circuits; forming a first electrode layer, which comprises transferring electrodes electrically connected to the first driving circuits, and pixel electrodes electrically connected to the second driving-circuits; forming a pixel-defining layer, which is provided with pixel openings and connecting via holes; forming a first pattern-defining layer, which covers the connecting via holes and exposes the pixel openings; forming an organic light-emitting-material layer, which covers the pixel openings and the first pattern-defining layer; removing the first pattern-defining layer, such that the organic light-emitting-material layer forms an organic light-emitting layer; forming a second pattern-defining layer surrounding the connecting via holes; and forming a second electrode layer, which comprises a common electrode and fingerprint-recognition electrodes isolated by the second pattern-defining layer.
Public/Granted literature
- US20220406858A1 ARRAY SUBSTRATE, FABRICATION METHOD THEREFOR AND DISPLAY DEVICE Public/Granted day:2022-12-22
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