Bonding member, method for producing bonding member and method for producing bonding structure

Invention Grant

US12134146B2 Bonding member, method for producing bonding member and method for producing bonding structure 有权

Patent Title: Bonding member, method for producing bonding member and method for producing bonding structure
Application No.: US17812352

Application Date: 2022-07-13
Publication No.: US12134146B2

Publication Date: 2024-11-05
Inventor: Katsuaki Suganuma , Chuantong Chen , Toshiyuki Ishina , Seungjun Noh , Chanyang Choe
Applicant: OSAKA UNIVERSITY
Applicant Address: JP Osaka
Assignee: OSAKA UNIVERSITY
Current Assignee: OSAKA UNIVERSITY
Current Assignee Address: JP Osaka
Agency: Studebaker & Brackett PC
Priority: JP2017-032043 20170223
Main IPC: B23K35/00
IPC: B23K35/00 ; B23K35/30 ; B32B15/01 ; H01L23/00

Abstract:

A bonding member (10) includes surface-processed silver surfaces (11a, 11b).

Public/Granted literature

Information query

Espacenet

IPC分类:

B	作业；运输
B23	机床；其他类目中不包括的金属加工
B23K	钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工（用金属的挤压来制造金属包覆产品入B21C23/22；用铸造方法制造衬套或包覆层入B22D19/08；用浸入方式的铸造入B22D23/04；用烧结金属粉末制造复合层入B22F7/00；机床上的仿形加工或控制装置入B23Q；不包含在其他类目中的包覆金属或金属包覆材料入C23C；燃烧器入F23D）
B23K35/00	用于钎焊、焊接或切割的焊条、电极、材料或介质