- Patent Title: Semiconductor device package and method of manufacturing the same
-
Application No.: US18080640Application Date: 2022-12-13
-
Publication No.: US12142571B2Publication Date: 2024-11-12
- Inventor: Chao Wei Liu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/31
Abstract:
A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate and an interconnection. The second substrate is arranged above the first substrate and has an opening. The interconnection passes through the opening and connects to the first substrate and the second substrate.
Public/Granted literature
- US20230114278A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-04-13
Information query
IPC分类:
