- Patent Title: Temperature sensor and method of manufacturing temperature sensor
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Application No.: US17758177Application Date: 2020-12-03
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Publication No.: US12148552B2Publication Date: 2024-11-19
- Inventor: Daisuke Arano , Morihisa Hamada
- Applicant: SHIBAURA ELECTRONICS CO., LTD.
- Applicant Address: JP Saitama
- Assignee: SHIBAURA ELECTRONICS CO., LTD.
- Current Assignee: SHIBAURA ELECTRONICS CO., LTD.
- Current Assignee Address: JP Saitama
- Agency: Pearne & Gordon LLP
- Priority: JP2020-003591 20200114
- International Application: PCT/JP2020/045048 WO 20201203
- International Announcement: WO2021/145088 WO 20210722
- Main IPC: H01C7/00
- IPC: H01C7/00 ; G01K7/22 ; H01C1/01 ; H01C7/02 ; H01C7/04

Abstract:
A temperature sensor includes: a first supporting film made of an electric insulation material; a second supporting film that is made of an electric insulation material and is stacked on the first supporting film; and a sensor element provided between the first supporting film and the second supporting film. The sensor element includes a thermosensitive body having electric characteristics that change with temperature, and a first lead pattern and a second lead pattern that are electrically connected to the thermosensitive body. The first supporting film and the second supporting film are disposed to face each other in a region where the thermosensitive body is provided.
Public/Granted literature
- US20230040761A1 TEMPERATURE SENSOR AND METHOD OF MANUFACTURING TEMPERATURE SENSOR Public/Granted day:2023-02-09
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