Invention Grant
- Patent Title: Semiconductor substrate and display device
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Application No.: US18181572Application Date: 2023-03-10
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Publication No.: US12148842B2Publication Date: 2024-11-19
- Inventor: Masataka Ikeda , Hirotaka Hayashi , Hitoshi Tanaka
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP2019-019792 20190206,JP2019-119960 20190627
- Main IPC: H01L29/786
- IPC: H01L29/786 ; G02F1/167 ; G02F1/16766 ; H01L27/12 ; H01L49/02

Abstract:
According to one embodiment, a semiconductor substrate includes a first basement, a gate line, a source line, an insulating film, a first pixel electrode, and a first transistor and a second transistor connected parallel at positions between the source line and the first pixel electrode. Each of a first semiconductor layer of the first transistor and a second semiconductor layer of the second transistor includes a first region, a second region, and a channel region. The first semiconductor layer and the second semiconductor layer are in contact with a first surface that is a surface of the insulating film on the source line side. The channel region of each of the first semiconductor layer and the second semiconductor layer wholly overlaps the gate line.
Public/Granted literature
- US20230215957A1 SEMICONDUCTOR SUBSTRATE AND DISPLAY DEVICE Public/Granted day:2023-07-06
Information query
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