- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US17351056Application Date: 2021-06-17
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Publication No.: US12148980B2Publication Date: 2024-11-19
- Inventor: Christophe Zinck
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L23/31 ; H01L23/66 ; H01P3/08
Abstract:
The present disclosure provides a semiconductor device package including a substrate, a waveguide component, and an antenna pattern. The substrate includes a feeding element. The waveguide component is disposed over the substrate. The antenna pattern is disposed over the substrate. The waveguide component is substantially aligned with the feeding element and the antenna pattern.
Public/Granted literature
- US20220407215A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-12-22
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