Semiconductor device package and method of manufacturing the same
Abstract:
The present disclosure provides a semiconductor device package including a substrate, a waveguide component, and an antenna pattern. The substrate includes a feeding element. The waveguide component is disposed over the substrate. The antenna pattern is disposed over the substrate. The waveguide component is substantially aligned with the feeding element and the antenna pattern.
Public/Granted literature
Information query
Patent Agency Ranking
0/0