Invention Grant
- Patent Title: Electronic device including housing
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Application No.: US17667755Application Date: 2022-02-09
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Publication No.: US12149274B2Publication Date: 2024-11-19
- Inventor: Heecheul Moon , Jina Mock , Moohyun Baek
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2021-0013275 20210129,KR10-2021-0086876 20210702
- Main IPC: H04B1/3888
- IPC: H04B1/3888 ; H01Q1/24 ; H04M1/02 ; H04N23/57 ; H05K5/00

Abstract:
An electronic device according to an embodiment of the disclosure may include a front plate, a rear plate, a side member surrounding space between the front plate and the rear plate, a support member located in the space and coupled to the side member, a display located between the front plate and the support member, a first adhesive member located between the front plate and the support member, and a second adhesive member located between the rear plate and the support member. The support member may include a first surface coupled to the side member, a second surface on which the display is disposed and which is separated from the first surface with the first adhesive member interposed therebetween, and a third surface located opposite to the second surface and separated from the first surface with the second adhesive member interposed therebetween. Various other embodiments are possible.
Public/Granted literature
- US20220271787A1 ELECTRONIC DEVICE INCLUDING HOUSING Public/Granted day:2022-08-25
Information query