Invention Grant
- Patent Title: Architecture for integrated access and backhaul with sidelink
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Application No.: US17385160Application Date: 2021-07-26
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Publication No.: US12150184B2Publication Date: 2024-11-19
- Inventor: Sony Akkarakaran , Navid Abedini , Naeem Akl , Tao Luo , Junyi Li
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04W76/10
- IPC: H04W76/10 ; H04W8/24 ; H04W12/06 ; H04W88/14

Abstract:
Methods, systems, and devices for wireless communications are described. The described techniques provide for first integrated access and backhaul (IAB) node establishing a signaling connection with an IAB donor node and a sidelink connection with a second IAB node or a user equipment (UE). The first IAB node may include a mobile termination unit and a distributed unit and may support sidelink communications. In some cases, the first IAB node may report an indication of sidelink communications support, receive an indication of sidelink communication authorization, and receive sidelink configuration information. The first IAB node may transmit one or more data messages to the IAB donor on the signaling connection and transmit one or more data messages to the second IAB node or the UE via the sidelink connection.
Public/Granted literature
- US20230027099A1 ARCHITECTURE FOR INTEGRATED ACCESS AND BACKHAUL WITH SIDELINK Public/Granted day:2023-01-26
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