Invention Grant
- Patent Title: Device and method of cutting polarizing plate
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Application No.: US17387950Application Date: 2021-07-28
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Publication No.: US12151313B2Publication Date: 2024-11-26
- Inventor: Kuhyun Kang , Ilyoung Jeong , Gyoowan Han
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2016-0164385 20161205
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/06 ; B23K26/0622 ; B23K26/082 ; B23K103/00 ; G02B5/30

Abstract:
A polarizing plate-cutting device including a laser beam generator configured to emit a laser beam, a scanner including a rotating mirror configured to reflect the laser beam emitted from the laser beam generator, and a housing accommodating the rotating mirror, a condenser lens configured to condense the laser beam reflected from the rotating mirror, and a mounting block onto which the laser beam condensed by the condenser lens is irradiated and to which a polarizing plate is mounted, wherein the mounting block is fixed with respect to the scanner while the polarizing plate is being cut, and wherein the polarizing plate includes a stacking of a base substrate and a polarizing layer, the base substrate being closer to the condenser lens than the polarizing layer, and a heat resistance of the polarizing layer being lower than that of the base substrate.
Public/Granted literature
- US20210354245A1 DEVICE AND METHOD OF CUTTING POLARIZING PLATE Public/Granted day:2021-11-18
Information query
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