Invention Grant
- Patent Title: Layered sheet, container, carrier tape, and electronic component packaging body
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Application No.: US17793538Application Date: 2021-03-08
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Publication No.: US12154818B2Publication Date: 2024-11-26
- Inventor: Yuko Fukuda , Junpei Fujiwara , Ryosuke Yanaka
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2020-049712 20200319
- International Application: PCT/JP2021/009012 WO 20210308
- International Announcement: WO2021/187198 WO 20210923
- Main IPC: B32B27/20
- IPC: B32B27/20 ; B32B27/08 ; H01L21/683

Abstract:
A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.
Public/Granted literature
- US12119255B2 Layered sheet, container, carrier tape, and electronic component packaging body Public/Granted day:2024-10-15
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