Invention Grant
- Patent Title: Electronic device including connecting member
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Application No.: US17970969Application Date: 2022-10-21
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Publication No.: US12155784B2Publication Date: 2024-11-26
- Inventor: Seongmin Kim , Byunggun Jang , Jinyoung Bang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2021-0141064 20211021
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H04M1/02

Abstract:
A printed circuit board module and an electronic device including the same are provided. The electronic device includes a housing including at least part thereof formed to be a conductive portion, a support member, a printed circuit board configured to be disposed on at least one surface of the support member and configured to dispose at least one electronic component thereon, and a connecting member for electrical coupling between the conductive portion of the housing and the electronic component, including a base plate and a connecting terminal. The connecting terminal includes a first portion fixed to the base plate, and a second portion coupled to the first portion and including a through hole formed thereon to be fastened to a fixing member, and the second portion may include a wing portion protruding to one direction.
Public/Granted literature
- US12113922B2 Electronic device including connecting member Public/Granted day:2024-10-08
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