Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17711914Application Date: 2022-04-01
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Publication No.: US12159938B2Publication Date: 2024-12-03
- Inventor: Hyojin Kim , Sangmoon Lee , Jinbum Kim , Yongjun Nam
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Fish & Richardson P.C.
- Priority: KR10-2021-0084802 20210629
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/02 ; H01L21/265 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device includes; a first fin vertically protruding from a substrate and extending in a first horizontal direction, a second fin vertically protruding from the substrate, an isolation layer contacting side surfaces of the first fin and the second fin, a first lower barrier layer on the first fin, a second lower barrier layer on the second fin, source/drain regions spaced apart in the first horizontal direction on the first lower barrier layer, channel layers disposed between the source/drain regions and vertically spaced apart on the first barrier layer, a gate structure intersecting the first lower barrier layer, surrounding each of the channel layers, and extending in a second horizontal direction, an upper barrier layer on the second lower barrier layer, and first semiconductor layers and second semiconductor layers stacked on the upper barrier layer.
Public/Granted literature
- US20220416086A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-12-29
Information query
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