Invention Grant
- Patent Title: Light-emitting diode device containing microlenses and method of making the same
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Application No.: US17551578Application Date: 2021-12-15
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Publication No.: US12159964B2Publication Date: 2024-12-03
- Inventor: Brian Kim , Ivan Huang , Saket Chadda
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L27/15 ; H01L33/32

Abstract:
A light-emitting device includes a backplane, light-emitting diodes (LEDs) located over a front side of the backplane, and microlenses respectively disposed over the LEDs. Each microlens includes a back surface having a first surface area and configured to receive light emitted from a corresponding LED, an opposing front surface having a second surface area and configured to emit the received light, and at least one sidewall extending from the front surface to the back surface. The second surface area is greater than the first surface area.
Public/Granted literature
- US20220223769A1 LIGHT-EMITTING DIODE DEVICE CONTAINING MICROLENSES AND METHOD OF MAKING THE SAME Public/Granted day:2022-07-14
Information query
IPC分类: