This disclosure describes systems and methods for metal foam cooling of vehicle electronic. An example apparatus may include an electronic control unit (ECU) comprising an electronic component included within a housing. The example apparatus may also include a metal foam configured to dissipate heat produced by the electronic component and also configured to facilitate electromagnetic interference (EMI) shielding for the electronic component. The example apparatus may also include an interface between the ECU and the metal foam, wherein the interface provides a connection between the ECU and metal foam to facilitate heat dissipation from the electronic component to a location outside of the housing.