Invention Grant
- Patent Title: Electronic device including support plate
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Application No.: US17835111Application Date: 2022-06-08
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Publication No.: US12160983B2Publication Date: 2024-12-03
- Inventor: Hyunjoong Yoon , Yongwon Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2021-0122238 20210914
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02

Abstract:
An electronic device and a support plate are disclosed. The electronic device includes a first housing, a display disposed within the first housing, a printed circuit board disposed within the first housing, a heat dissipation plate disposed to face the printed circuit board, at least one heat pipe disposed between the heat dissipation plate and the printed circuit board, the support plate disposed between the printed circuit board and the heat dissipation plate. The support plate includes a first portion disposed so as to contact with at least a part of the at least one heat pipe, and a second portion extending from the first portion in a second direction perpendicular to a first direction in which the at least one heat pipe is disposed, the second portion coupled to at least a part of the heat dissipation plate.
Public/Granted literature
- US20230082434A1 ELECTRONIC DEVICE INCLUDING SUPPORT PLATE Public/Granted day:2023-03-16
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