Invention Grant
- Patent Title: Flexible printed circuit board having waterproof structure and foldable electronic device including the same
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Application No.: US17879280Application Date: 2022-08-02
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Publication No.: US12167531B2Publication Date: 2024-12-10
- Inventor: Jihoon Kang , Jongmin Kang , Chungil Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: CANTOR COLBURN LLP
- Priority: KR10-2021-0104878 20210809,KR10-2021-0162549 20211123
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H04M1/18 ; H04M1/22 ; H05K5/00 ; H05K5/06

Abstract:
An electronic device includes a first housing having a first through-hole, of which a first opening and a second opening are communicated with each other, and a second housing connected to the first housing to be rotatable. A flexible printed circuit board (FPCB) extends from the first housing to the second housing via the first through-hole. The FPCB includes a plurality of layers, a first sealing member disposed in the first through-hole and surrounding the FPCB, and a lamination part toward the first sealing member. A portion of a first layer and/or a second layer corresponding to the second lamination part includes at least one first valley extending from a surface that faces an adjacent layer in a lengthwise direction of the FPCB. The lamination part includes a first adhesive layer interposed between the first layer and the second layer and filling the at least one first valley.
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