Invention Grant
- Patent Title: Substrate processing apparatus and substrate alignment method using the same
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Application No.: US17957967Application Date: 2022-09-30
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Publication No.: US12172313B2Publication Date: 2024-12-24
- Inventor: Daejung Kim , Minyoung Kang , Sungsoo Kim , Sohee Kim , Yongsoo Yoo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2022-0024592 20220224
- Main IPC: B25J9/16
- IPC: B25J9/16 ; B25J11/00 ; B25J19/02

Abstract:
A method includes performing a substrate processing process by carrying a substrate into a chamber, and disposing the substrate in a loading region of the chamber, capturing an image of a lower surface of the substrate to acquire a first image, identifying particle patterns formed on the lower surface of the substrate in the substrate processing process, and an edge of the substrate, from the first image, calculating a first alignment error value of a deviation between an approximate position value for the center of the loading region calculated from the particle patterns and an approximate position value for a center of the substrate calculated from the edge of the substrate, and determining a point in time for teaching a transfer robot that deposits the substrate into the chamber, based on the first alignment error value.
Public/Granted literature
- US20230264350A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE ALIGNMENT METHOD USING THE SAME Public/Granted day:2023-08-24
Information query
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