Invention Grant
- Patent Title: Die cushion device
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Application No.: US17559895Application Date: 2021-12-22
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Publication No.: US12172403B2Publication Date: 2024-12-24
- Inventor: Tadahiro Kondo
- Applicant: AIDA ENGINEERING, LTD.
- Applicant Address: JP Kanagawa
- Assignee: AIDA ENGINEERING, LTD.
- Current Assignee: AIDA ENGINEERING, LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Rimon P.C.
- Priority: JP2020-216637 20201225
- Main IPC: B30B15/16
- IPC: B30B15/16 ; B21D24/02 ; B30B15/06

Abstract:
The die cushion device includes a first hydraulic cylinder for supporting a cushion pad, and a first hydraulic circuit for driving the first hydraulic cylinder. The first hydraulic circuit is a hydraulic closed circuit including a logic valve connected between a die cushion pressure generation line and a system pressure line, and a hydraulic pump driven by a first servomotor for applying a pilot pressure to the logic valve. The first controller controls the first servomotor (pilot pressure) based on a first pressure command corresponding to the die cushion force and the pressure detected by the first pressure detector to control the pressure in a lower chamber of the first hydraulic cylinder so that the pressure is equal to a pressure corresponding to the first pressure command.
Public/Granted literature
- US20220203643A1 DIE CUSHION DEVICE Public/Granted day:2022-06-30
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