Invention Grant
- Patent Title: Memory device
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Application No.: US18336428Application Date: 2023-06-16
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Publication No.: US12176062B2Publication Date: 2024-12-24
- Inventor: He-Zhou Wan , Xiu-Li Yang , Pei-Le Li , Ching-Wei Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. , TSMC Nanjing Company Limited , TSMC China Company Limited
- Applicant Address: TW Hsinchu; CN Nanjing; CN Shanghai
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,TSMC Nanjing Company Limited,TSMC China Company Limited
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,TSMC Nanjing Company Limited,TSMC China Company Limited
- Current Assignee Address: TW Hsinchu; CN Nanjing; CN Shanghai
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: CN202110136033.9 20210201
- Main IPC: G11C7/10
- IPC: G11C7/10 ; G11C5/14 ; G11C7/12 ; G11C8/10

Abstract:
A memory device includes a memory array, a first latch and a first logic element. The memory array is configured to operate according to a first global write signal. The first latch is configured to generate a first latch write data based on a clock signal. The first logic element is configured to generate the first global write signal based on the clock signal and the first latch write data.
Public/Granted literature
- US20230326501A1 MEMORY DEVICE Public/Granted day:2023-10-12
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