Invention Grant
- Patent Title: Extreme high throughput signaling structure
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Application No.: US17858796Application Date: 2022-07-06
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Publication No.: US12177723B2Publication Date: 2024-12-24
- Inventor: Xiaogang Chen , Qinghua Li , Thomas J. Kenney , Feng Jiang , Laurent Cariou , Ziv Avital , Chen Kojokaro , Robert Stacey
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Eversheds Sutherland (US) LLP
- Main IPC: H04W28/06
- IPC: H04W28/06 ; H04L5/00 ; H04W72/0453 ; H04W76/10

Abstract:
This disclosure describes systems, methods, and devices related to an extreme high throughput (EHT) signaling structure. A device may establish a communication channel with one or more station devices (STAs). The device may generate an extreme high throughput signal field (EHT-SIG) of a header, wherein the EHT-SIG field comprises information associated with resource allocations (RUs). The device may generate a frame comprising the header. The device may assign a first RU to a first station device. The device may assign a second RU to the first station device, wherein the first RU or the second RU is an aggregation of a 26-tome RU and a neighboring RU. The device may cause to send the frame to the first station device.
Public/Granted literature
- US20230024519A1 EXTREME HIGH THROUGHPUT SIGNALING STRUCTURE Public/Granted day:2023-01-26
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