Invention Grant
- Patent Title: Chip test circuit and circuit test method
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Application No.: US18175306Application Date: 2023-02-27
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Publication No.: US12181519B2Publication Date: 2024-12-31
- Inventor: Changming Cui , Junlin Huang , Yu Huang , Haitao Fu
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Fish & Richardson P.C.
- Main IPC: G01R31/317
- IPC: G01R31/317 ; G01R31/3185

Abstract:
This disclosure provides methods and apparatuses for testing a tested circuit. In an implementation, a chip test circuit transmits input data of a test vector to a data distribution circuit through an input of a test bus, and transmits the input data of the test vector to a scan input channel of a tested circuit through the data distribution circuit. After scanning of the tested circuit ends, output data of the test vector of the scan output channel of the tested circuit is transmitted to an output of the test bus through the data distribution circuit to complete the test of the tested circuit. A dynamic correspondence between the data distribution circuit and the test bus is implemented by configuring a first selector, so that test resources can be dynamically allocated.
Public/Granted literature
- US20230204660A1 CHIP TEST CIRCUIT AND CIRCUIT TEST METHOD Public/Granted day:2023-06-29
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