Invention Grant
- Patent Title: Ceramic electronic component
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Application No.: US17706005Application Date: 2022-03-28
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Publication No.: US12183515B2Publication Date: 2024-12-31
- Inventor: Seong Hwan Park , Kyung Moon Jung , Sung Jun Lim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR10-2021-0180897 20211216
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/12 ; H01G4/30

Abstract:
A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first band electrode disposed on a portion of the first surface adjacent to the third surface; a second band electrode disposed on another portion of the first surface adjacent to the fourth surface; and insulating members disposed between the first and second band electrodes disposed on the first surface and spaced apart from each other, wherein the first surface is exposed through a space between the plurality of insulating members.
Public/Granted literature
- US20230197342A1 CERAMIC ELECTRONIC COMPONENT Public/Granted day:2023-06-22
Information query