Invention Grant
- Patent Title: Semiconductor package with dummy MIM capacitor die
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Application No.: US17973318Application Date: 2022-10-25
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Publication No.: US12183723B2Publication Date: 2024-12-31
- Inventor: Yao-Chun Su , Chih-Ching Chen , I-Hsuan Peng , Yi-Jou Lin
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/00 ; H01L23/16 ; H01L23/31 ; H01L23/367 ; H01L23/538 ; H01L49/02
Abstract:
A semiconductor package including at least one functional die; at least one dummy die free of active circuit, wherein the dummy die comprises at least one metal-insulator-metal (MIM) capacitor; and a redistribution layer (RDL) structure interconnecting the MIM capacitor to the at least one functional die.
Public/Granted literature
- US20230044797A1 SEMICONDUCTOR PACKAGE WITH DUMMY MIM CAPACITOR DIE Public/Granted day:2023-02-09
Information query
IPC分类:
