Invention Grant
- Patent Title: Enhanced bandwidth puncturing
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Application No.: US18343430Application Date: 2023-06-28
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Publication No.: US12184411B2Publication Date: 2024-12-31
- Inventor: Yanjun Sun , Alfred Asterjadhi , George Cherian , Abhishek Pramod Patil , Sai Yiu Duncan Ho
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Holland & Hart LLP
- Agent Kevin M. Donnelly
- Main IPC: H04L1/00
- IPC: H04L1/00 ; H04L1/1607 ; H04L5/00 ; H04W74/0816

Abstract:
This disclosure provides methods, devices and systems for enhanced bandwidth puncturing. Some implementations more specifically relate to punctured channel indications that support channel puncturing over a range of bandwidths achievable in accordance with the Institute of Electrical and Electronics Engineers (IEEE) 802.11be amendment, and future generations, of the IEEE 802.11 standard. In some implementations, an access point (AP) may communicate static punctured channel information to each associated wireless station (STA) in its BSS. In some other implementations, a transmit opportunity (TXOP) holder may communicate dynamic punctured channel information to a TXOP responder with which it intends to communicate. Still further, in some implementations, the TXOP responder may communicate additional punctured channel information to the TXOP holder responsive to the dynamic punctured channel information.
Public/Granted literature
- US20230361911A1 ENHANCED BANDWIDTH PUNCTURING Public/Granted day:2023-11-09
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