Invention Grant
- Patent Title: Multi-part device enclosure
-
Application No.: US18094157Application Date: 2023-01-06
-
Publication No.: US12189439B2Publication Date: 2025-01-07
- Inventor: Mikael M. Silvanto , Simon J. Trivett , Matthew S. Theobald , Dinesh C. Mathew , Simon R. Lancaster-Larocque , Robert Y. Cao , Ari P. Miller , Kevin M. Robinson , Houtan R. Farahani , Francesco Ferretti , John Raff , Robert J. Lockwood , Genie Kim , Karan Bir , Keith J. Hendren , Gurshan Deol , Antonio Clarke , Prabhu Sathyamurthy , William A. Counts
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: G06F1/18
- IPC: G06F1/18 ; G06F1/16 ; H04M1/02

Abstract:
An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
Public/Granted literature
- US20230161390A1 MULTI-PART DEVICE ENCLOSURE Public/Granted day:2023-05-25
Information query