Invention Grant
- Patent Title: Method of manufacturing formed body for electrode
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Application No.: US17525976Application Date: 2021-11-15
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Publication No.: US12191471B2Publication Date: 2025-01-07
- Inventor: Eijiro Iwase , Akihito Fukunaga , Koji Tonohara
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM CORPORATION
- Current Assignee: FUJIFILM CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: SOLARIS Intellectual Property Group, PLLC
- Priority: JP2019-122367 20190628
- Main IPC: H01M4/04
- IPC: H01M4/04

Abstract:
The present disclosure provides a method of manufacturing a formed body for an electrode comprising in order: a step of preparing an electrode material containing an electrode active material; a step of supplying the electrode material to a forming mold which has a frame-shaped side wall portion defining a space portion accommodating the electrode material and has a first support placed on a bottom surface of the forming mold; a step of forming the electrode material along an internal shape of the forming mold; and a step of taking out the electrode material from the forming mold.
Public/Granted literature
- US20220077447A1 METHOD OF MANUFACTURING FORMED BODY FOR ELECTRODE Public/Granted day:2022-03-10
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