Invention Grant
- Patent Title: Method of manufacturing formed body for electrode
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Application No.: US17647601Application Date: 2022-01-11
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Publication No.: US12199264B2Publication Date: 2025-01-14
- Inventor: Akihito Fukunaga , Eijiro Iwase , Koji Tonohara , Yasuhiro Sekizawa
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM CORPORATION
- Current Assignee: FUJIFILM CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: SOLARIS Intellectual Property Group, PLLC
- Priority: JP2019-149869 20190819
- Main IPC: H01M4/04
- IPC: H01M4/04

Abstract:
The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of forming at least two projecting portions containing the electrode material and placed side by side on a support in a width direction of the support by supplying the electrode material onto the support; and a step of leveling the projecting portions on the support.
Public/Granted literature
- US20220131128A1 METHOD OF MANUFACTURING FORMED BODY FOR ELECTRODE Public/Granted day:2022-04-28
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