Invention Grant
- Patent Title: Heat radiant heater
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Application No.: US17622056Application Date: 2020-06-29
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Publication No.: US12200830B2Publication Date: 2025-01-14
- Inventor: Masaharu Ito , Takashi Morioka
- Applicant: LINTEC Corporation
- Applicant Address: JP Tokyo
- Assignee: LINTEC Corporation
- Current Assignee: LINTEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rimon P.C.
- Priority: JP2019-125119 20190704
- International Application: PCT/JP2020/025550 WO 20200629
- International Announcement: WO2021/002331 WO 20210107
- Main IPC: H05B3/26
- IPC: H05B3/26

Abstract:
A thermal radiation heater includes: a heater element layer including a planar conductive body; at least one front surface side layer including an outermost layer and provided close to a front surface of the heater element layer; and at least one back surface side layer including an outermost layer and provided close to a back surface of the heater element layer. The outermost layer close to the front surface has an emissivity of 0.7 or more, and the outermost layer close to the back surface has an emissivity of 0.6 or less.
Public/Granted literature
- US20220322496A1 HEAT RADIANT HEATER Public/Granted day:2022-10-06
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