Invention Grant
- Patent Title: Electrospun medical devices and methods of making electrospun medical devices
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Application No.: US16519738Application Date: 2019-07-23
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Publication No.: US12201516B2Publication Date: 2025-01-21
- Inventor: Evaldas Karciauskas , Salvador Avelar , Todd Grodrian , Mike Krivoruchko , Mingfei Chen , Christopher Storment , David A. Shumaker , Mark M. Wegner , Joseph A. Traina
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Wentsler LLC
- Main IPC: D04H1/728
- IPC: D04H1/728 ; A61F2/24 ; B29C33/34 ; B29C33/38 ; B29C33/42 ; B29C35/02 ; B29C35/16 ; B29C37/00 ; D01D5/00 ; A61L27/34
Abstract:
A method of forming an electrospun prosthetic valve includes utilizing a rotatable and angularly adjustable prosthetic valve mold. The prosthetic valve mold is set to a first angle. The prosthetic valve mold is rotated at a first rotational velocity and a first layer of electrospun fibers is deposited on the prosthetic valve mold. The prosthetic valve mold is stopped and a frame is positioned over the first layer. The prosthetic valve mold is set to a second angle. The prosthetic valve mold is rotated at a second velocity and a second layer of electrospun fibers is deposited on an outer surface of the first layer and an outer surface of the frame.
Public/Granted literature
- US20200022807A1 ELECTROSPUN MEDICAL DEVICES AND METHODS OF MAKING ELECTROSPUN MEDICAL DEVICES Public/Granted day:2020-01-23
Information query
