Invention Grant
- Patent Title: Rating substrate support assemblies based on impedance circuit electron flow using machine learning
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Application No.: US17158811Application Date: 2021-01-26
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Publication No.: US12205791B2Publication Date: 2025-01-21
- Inventor: Arvind Shankar Raman , Harikrishnan Rajagopal , John Forster
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01J37/244
- IPC: H01J37/244 ; G01R21/133 ; G01R27/26 ; G06N20/00 ; H01J37/32 ; H01L21/67 ; H01L21/683 ; H04Q9/00

Abstract:
Methods and systems for rating a current substrate support assembly based on impedance circuit electron flow are provided. Data associated with an amount of radio frequency (RF) power flowed through an electrical component of a current substrate support assembly during a current testing process performed for the current substrate support assembly is provided as input to a trained machine learning model. One or more outputs of the trained machine learning model are obtained. A measurement value for an electron flow across an impedance circuit of the current substrate support assembly is extracted from the one or more outputs. In response to a determination that the extracted measurement value for the electron flow satisfies an electron flow criterion, a first quality rating is assigned to the current substrate support assembly.
Public/Granted literature
- US20220238300A1 RATING SUBSTRATE SUPPORT ASSEMBLIES BASED ON IMPEDANCE CIRCUIT ELECTRON FLOW Public/Granted day:2022-07-28
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