Invention Grant
- Patent Title: Non-woven film for electronic components and fabricating method thereof
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Application No.: US17540372Application Date: 2021-12-02
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Publication No.: US12209357B2Publication Date: 2025-01-28
- Inventor: Shao-Yen Chang , Shang-Chih Chou , Chun-Hung Lin
- Applicant: TAIWAN TEXTILE RESEARCH INSTITUTE
- Applicant Address: TW New Taipei
- Assignee: TAIWAN TEXTILE RESEARCH INSTITUTE
- Current Assignee: TAIWAN TEXTILE RESEARCH INSTITUTE
- Current Assignee Address: TW New Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW109143050 20201207
- Main IPC: D06M11/79
- IPC: D06M11/79 ; D06M10/02 ; D06M10/06 ; D06M101/30
Abstract:
A non-woven film for electronic components is provided in the present disclosure. The non-woven film for electronic components includes a polyetherimide substrate and an aerogel. The aerogel is disposed on the polyetherimide substrate. The aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.
Public/Granted literature
- US20220178071A1 NON-WOVEN FILM FOR ELECTRONIC COMPONENTS AND FABRICATING METHOD THEREOF Public/Granted day:2022-06-09
Information query
