Invention Grant
- Patent Title: Substrate assembly
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Application No.: US18513901Application Date: 2023-11-20
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Publication No.: US12216873B2Publication Date: 2025-02-04
- Inventor: Chia-Hsiung Chang , Yang-Chen Chen , Kuo-Chang Su , Hsia-Ching Chu
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW104109150 20150323
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F3/041

Abstract:
A substrate assembly is provided, including a first substrate, an active element layer, a plurality of first electrodes, a circuit substrate, and a plurality of second electrodes. The active element layer is disposed on the first substrate. The plurality of first electrodes are disposed on the first substrate and arranged along a first direction. The circuit substrate is partially overlapping the first substrate in a vertical projection direction. The plurality of second electrodes are disposed on the circuit substrate. A distance between the edge of one of the plurality of second electrodes and the edge of one of the plurality of first electrodes is greater than zero in the first direction, and a width of the one of the plurality of first electrodes is different from a width of the one of the plurality of second electrodes.
Public/Granted literature
- US20240086021A1 SUBSTRATE ASSEMBLY Public/Granted day:2024-03-14
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