Invention Grant
- Patent Title: Fingerprint identification substrate, electronic apparatus and fingerprint identification method
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Application No.: US17907939Application Date: 2021-09-29
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Publication No.: US12217529B2Publication Date: 2025-02-04
- Inventor: Hao Liu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: BROOKS KUSHMAN P.C.
- International Application: PCT/CN2021/121740 WO 20210929
- International Announcement: WO2023/050163 WO 20230406
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06V40/13

Abstract:
The present disclosure provides a fingerprint identification substrate, an electronic apparatus and a fingerprint identification method. The fingerprint identification substrate includes a base substrate, a driving circuitry layer arranged on the base substrate, a shielding layer arranged at a side of the driving circuitry layer away from the base substrate and a detection electrode arranged at a side of the shielding layer away from the base substrate. The detection electrode is electrically coupled to a fingerprint detection circuitry arranged on the driving circuitry layer, the shielding layer is insulated from the detection electrode, and an orthogonal projection of the shielding layer onto the base substrate at least partially overlaps an orthogonal projection of the detection electrode onto the base substrate.
Public/Granted literature
- US20240193983A1 FINGERPRINT IDENTIFICATION SUBSTRATE, ELECTRONIC APPARATUS AND FINGERPRINT IDENTIFICATION METHOD Public/Granted day:2024-06-13
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