- Patent Title: Cryogenic packaging for thermalization of low temperature devices
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Application No.: US16445470Application Date: 2019-06-19
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Publication No.: US12219737B2Publication Date: 2025-02-04
- Inventor: Oblesh Jinka , Salvatore Bernardo Olivadese , Sean Hart , Nicholas Torleiv Bronn , Jerry M. Chow , Markus Brink , Patryk Gumann , Daniela Florentina Bogorin
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Garg Law Firm, PLLC
- Agent Rakesh Garg; Erik Johnson
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F30/20 ; G06N10/00 ; H01L21/265 ; H01L23/31 ; H01L23/32 ; H01L31/02 ; F28D21/00 ; G06F113/20
Abstract:
A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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