Invention Grant
- Patent Title: Joint apparatus for robot
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Application No.: US18136040Application Date: 2023-04-18
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Publication No.: US12220811B2Publication Date: 2025-02-11
- Inventor: Jinsoo Jeong , Jinwoong Kim , Jinho Choi , Cheoggyu Hwang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2021-0002836 20210108
- Main IPC: B25J17/00
- IPC: B25J17/00 ; B25J9/10 ; F16C19/26 ; F16C35/077 ; F16H19/08 ; F16H49/00

Abstract:
A joint apparatus for a robot includes a housing, a bearing including an inner ring and an outer ring contacting the housing, a rotating member contacting the inner ring of the bearing, and a driving apparatus configured to rotate the rotating member, where the first housing includes a first support region configured to support a front surface of the outer ring and a first fastening region extending rearward from the first support region and on which a first thread is formed, the sounding housing includes a second support region configured to support a rear surface of the outer ring and a second fastening region extending forward from the second support region and on which a second thread is formed, and the second thread is configured to engage the first thread.
Public/Granted literature
- US20230256624A1 JOINT APPARATUS FOR ROBOT Public/Granted day:2023-08-17
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