Invention Grant
- Patent Title: Circuit board assembly, backplane interconnection system, and electronic device
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Application No.: US17680659Application Date: 2022-02-25
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Publication No.: US12224512B2Publication Date: 2025-02-11
- Inventor: Huahua Xu , Xinhu Gong , Yinzhong Tang
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Priority: CN201910791746.1 20190826
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H05K7/14

Abstract:
A circuit board assembly, a backplane interconnection system, and an electronic device are disclosed. The circuit board assembly includes a bracket and a circuit board, the circuit board is formed with a fastened part and a free part, the fastened part is connected to the bracket, the free part is suspended, a surface on which the free part and the fastened part are co-located is a first plane, the free part has an amplitude of swing in a first direction, the first direction is perpendicular to the first plane, the circuit board is configured to plug-connect to a front sub-circuit board, a first connector plug-connected to a first plug-connection end on the front sub-circuit board is disposed on the free part, and the amplitude of swing is capable of enabling the first connector to plug-connect to the first plug-connection end.
Public/Granted literature
- US20220181810A1 CIRCUIT BOARD ASSEMBLY, BACKPLANE INTERCONNECTION SYSTEM, AND ELECTRONIC DEVICE Public/Granted day:2022-06-09
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