Invention Grant
- Patent Title: Substrate treating apparatus and substrate treating method
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Application No.: US17515737Application Date: 2021-11-01
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Publication No.: US12230516B2Publication Date: 2025-02-18
- Inventor: Jae Oh Bang , Young Seo An , Seung Han Lee , Seung Hwan Lee , Hyun Min Kim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Carter, DeLuca & Farrell LLP
- Priority: KR10-2020-0144342 20201102
- Main IPC: H01L21/67
- IPC: H01L21/67 ; F27B17/00 ; F27D7/02 ; F27D99/00 ; H01L21/324 ; H01L21/66 ; F27D5/00 ; F27D19/00

Abstract:
The inventive concept relates to a substrate treating apparatus including a process chamber having a first and a second body, a support unit supporting a substrate, a heating unit heats the substrate, a driver moves any one of the first body and the second body, an interval state detection unit that detects an interval state between a side wall of the first body and a side wall of the second body when the first and the second body are placed in a process location, and a controller that controls the driver and the interval state detection unit, wherein the interval state detection unit includes a pressure provision line that provides a positive pressure or a negative pressure between the side wall of the first body and the side wall of the second body, and a pressure measurement member that measures a change in a pressure of the pressure provision line.
Public/Granted literature
- US20220139738A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD Public/Granted day:2022-05-05
Information query
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