Invention Grant
- Patent Title: Reduced sensing schemes for sidelink enhancement
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Application No.: US17364674Application Date: 2021-06-30
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Publication No.: US12232113B2Publication Date: 2025-02-18
- Inventor: Chunxuan Ye , Dawei Zhang , Haijing Hu , Haitong Sun , Hong He , Jia Tang , Oghenekome Oteri , Weidong Yang , Zhibin Wu , Wei Zeng
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H04W72/20
- IPC: H04W72/20
Abstract:
The present application relates to devices and components including apparatus, systems, and methods to provide reduced sensing schemes to facilitate sidelink transmissions.
Information query
