Invention Grant
- Patent Title: Electronic device including sheilding structure
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Application No.: US17986242Application Date: 2022-11-14
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Publication No.: US12238911B2Publication Date: 2025-02-25
- Inventor: Haejin Lee , Min Park , Kyuhwan Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye P.C.
- Priority: KR10-2021-0155669 20211112,KR10-2021-0180997 20211216
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H04M1/02 ; H05K1/02

Abstract:
The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.
Public/Granted literature
- US20230156989A1 ELECTRONIC DEVICE INCLUDING SHEILDING STRUCTURE Public/Granted day:2023-05-18
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